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Valuation: Shenzhen Fastprint Circuit Tech Co.,Ltd.

Market Cap 64.16B 9.48B 8.19B 7.55B 7.06B 13.24B 901B 13.44B 89.1B 34.74B 439B 35.58B 34.82B 1,519B P/E Ratio 2026 *
84.1x
P/E Ratio 2027 * 66.9x
Enterprise Value 68.88B 10.18B 8.79B 8.1B 7.58B 14.21B 967B 14.43B 95.65B 37.29B 471B 38.2B 37.39B 1,630B EV / Sales 2026 *
5.97x
EV / Sales 2027 * 4.78x
Free-Float
74.03%
Yield 2026 *
0.36%
Yield 2027 * 0.45%
04-27 Shenzhen Fastprint Circuit Tech Co.,Ltd. announces Annual dividend, payable on May 28, 2026 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2026 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2025 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. announces an Equity Buyback for CNY 100 million worth of its shares. CI
04-23 Shenzhen Fastprint Circuit Tech Co.,Ltd. authorizes a Buyback Plan. CI
03-16 Fastprint Circuit Tech to Buy Wealth Management Products for 550 Million Yuan; Shares Down 4% MT
30/10/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2025 CI
27/08/25 Fastprint Circuit Tech H1 Profit up 49%, Revenue Climbs 19% MT
26/08/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2025 CI
04/08/25 Connexion Technologies Limited acquired eXception PCB Solutions Limited. CI
29/07/25 Shenzhen Fastprint Circuit Tech Finalizes 24% Stake Acquisition in Guangzhou Xinke Semiconductor MT
28/07/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. acquired an additional 24% stake in Guangzhou Xingke Semiconductor Co., Ltd. from China Integrated Circuit Industry Investment Fund Co., Ltd. managed by Huaxin Investment Management Co., Ltd. for approximately CNY 320 million. CI
12/06/25 Fastprint Circuit Tech Bids for 24% Stake in Semiconductor Subsidiary MT
1 day+2.86%
1 week-0.26%
Current month-2.28%
1 month+15.56%
3 months+57.89%
6 months+87.41%
Current year+78.55%
1 week 35.5
Extreme 35.5
39.96
1 month 31
Extreme 31
42.6
Current year 19.51
Extreme 19.51
42.6
1 year 11.39
Extreme 11.39
42.6
3 years 8.05
Extreme 8.05
42.6
5 years 7.24
Extreme 7.24
42.6
10 years 3.02
Extreme 3.02
42.6
Manager TitleAgeSince
Chief Executive Officer 58 01/03/1999
Director of Finance/CFO 41 29/10/2025
Chief Tech/Sci/R&D Officer 53 07/05/2021
Director TitleAgeSince
Chairman 58 01/03/1999
Director/Board Member 57 21/04/2017
Director/Board Member 41 11/09/2025
Date Insider Type Main position Quantity % Market Cap.
24/09/25Buy

Chief Executive Officer

50,000 0.0033%
23/09/25Sell

Chief Executive Officer

1,322,900 0.0882%
15/09/25Sell

Chief Executive Officer

2,420,000 0.1613%
Change 5-day change 1-year change 3-year change Capi.($)
+2.86%-0.26%+235.70%+125.13% 9.48B
+2.33%-2.79%+234.40%+435.90% 211B
-2.25%-5.29%+79.12%+216.34% 91.89B
+3.11%-1.74%+591.73%+755.82% 58.6B
-5.20%-1.13%+461.63%+1,891.75% 54.73B
+0.53%-3.45%+211.30%+1,125.96% 47.51B
+5.62%-3.32%+780.00%+399.72% 45.31B
-2.40%-2.13% - - 41.09B
+0.89%+1.74%+297.38%+522.21% 38.2B
-1.35%-6.02%+224.18%+438.73% 35.6B
Average +0.41%-0.12%+346.16%+656.84% 63.34B
Weighted average by Cap. +0.59%+0.30%+310.01%+621.36%

Financials

2026 *2027 *
Net sales 11.53B 1.7B 1.47B 1.36B 1.27B 2.38B 162B 2.42B 16.01B 6.24B 78.81B 6.39B 6.26B 273B 14.4B 2.13B 1.84B 1.69B 1.58B 2.97B 202B 3.02B 19.99B 7.79B 98.42B 7.98B 7.81B 341B
Net income - -
Net Debt 4.72B 697M 602M 555M 519M 974M 66.28B 989M 6.55B 2.56B 32.26B 2.62B 2.56B 112B 4.64B 686M 592M 546M 511M 958M 65.19B 972M 6.45B 2.51B 31.73B 2.57B 2.52B 110B
Logo Shenzhen Fastprint Circuit Tech Co.,Ltd.
Shenzhen Fastprint Circuit Tech Co Ltd is a China-based company principally engaged in printed circuit board (PCB) business and semiconductor business. The printed circuit board business is mainly engaged in research and development, design, production and sales of printed circuit boards. The semiconductor business includes integrated circuit (IC) packaging substrates and semiconductor test board businesses. Integrated circuit packaging substrate products include chip-scale packaging (CSP) substrates and flip chip ball grid array (FCBGA) packaging substrates, and the application areas include memory chips, radio frequency chips, application processor chips and others. Semiconductor test board product types include probe cards, test load boards, aging boards, and adapter boards, which are used in various processes from wafer testing to post-packaging testing. The Company mainly conducts its businesses in the domestic and overseas markets.
Employees
7,761
Date Price Change Volume
12/06/26 37.80 ¥ +2.86% 190,258,700
11/06/26 36.75 ¥ -1.42% 127,981,500
10/06/26 37.28 ¥ -2.28% 155,084,600
09/06/26 38.15 ¥ +3.11% 132,603,149
08/06/26 37.00 ¥ -2.37% 142,685,777
Trader
Investor
Global
Quality
-
ESG MSCI
-
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
2
Last Close Price
37.80CNY
Average target price
19.40CNY
Spread / Average Target
-48.68%

Quarterly revenue - Rate of surprise

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