Valuation: Tera Probe, Inc.

Market Cap 126B 785M 686M 630M 587M 1.11B 74.71B 1.13B 7.58B 2.94B 36.64B 2.95B 2.88B P/E 2026 *
24x
P/E 2027 * 20x
Enterprise Value 126B 785M 686M 630M 587M 1.11B 74.71B 1.13B 7.58B 2.94B 36.64B 2.95B 2.88B EV / Sales 2026 *
2.22x
EV / Sales 2027 * 1.8x
Free-Float
36.64%
Yield 2026 *
1.14%
Yield 2027 * 1.32%
1 day+5.07%
1 week+1.39%
Current month+3.27%
1 month+26.41%
3 months+73.07%
6 months+120.32%
Current year+120.32%
1 week 12,290
Extreme 12290
14,370
1 month 8,510
Extreme 8510
14,960
Current year 6,290
Extreme 6290
14,960
1 year 3,125
Extreme 3125
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 01/03/2020
President 59 26/03/2020
Chief Tech/Sci/R&D Officer 55 01/03/2020
Director TitleAgeSince
Director/Board Member 59 01/09/2005
Director/Board Member 55 01/06/2013
Director/Board Member 75 01/09/2005
Change 5-day change 1-year change 3-year change Capi.($)
+5.07%+1.39%+335.11%+263.83% 747M
+7.37%-8.98%+155.73%+385.65% 308B
+1.84%-18.26%+181.49%+512.95% 130B
+1.06%-21.80%+291.90%+231.53% 57.78B
-2.35%-0.79%+399.27% - 39.65B
+0.41%-2.35%+589.23%+537.42% 28.08B
-3.81%-16.72%+156.23%+186.73% 15.05B
-15.07%-1.04%+375.04%+335.29% 13.28B
-3.60%+0.15%+223.67%+487.72% 13.32B
-3.75%-12.90%+92.98%+112.07% 9.92B
Average -3.17%-4.11%+280.06%+339.24% 61.53B
Weighted average by Cap. -5.95%-6.14%+214.85%+397.42%

Financials

2026 *2027 *
Net sales 57B 354M 310M 284M 265M 503M 33.73B 511M 3.42B 1.33B 16.54B 1.33B 1.3B 70B 435M 380M 349M 326M 617M 41.42B 628M 4.2B 1.63B 20.32B 1.63B 1.6B
Net income 5B 31.08M 27.15M 24.93M 23.25M 44.08M 2.96B 44.83M 300M 116M 1.45B 117M 114M 6B 37.29M 32.58M 29.92M 27.9M 52.9M 3.55B 53.79M 360M 140M 1.74B 140M 137M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
03/07/26 ¥13,880.00 +5.07% 139,500
02/07/26 ¥13,210.00 -7.62% 204,600
01/07/26 ¥14,300.00 +6.40% 144,000
30/06/26 ¥13,440.00 +4.67% 166,400
29/06/26 ¥12,840.00 -2.80% 151,700
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
13,880.00
Average target price
-

Quarterly revenue - Rate of surprise

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