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Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 66.22B 2.1B 1.81B 1.66B 1.56B 2.93B 198B 2.96B 19.68B 7.69B 97.14B 7.88B 7.71B 336B P/E Ratio 2026 *
22.4x
P/E Ratio 2027 * 15.9x
Enterprise Value 69.51B 2.2B 1.9B 1.75B 1.64B 3.08B 208B 3.11B 20.66B 8.07B 102B 8.27B 8.09B 353B EV / Sales 2026 *
2.27x
EV / Sales 2027 * 2.01x
Free-Float
78.37%
Yield 2026 *
1.3%
Yield 2027 * 2.1%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Director/Board Member 54 01/07/2021
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 2.13B
-1.91%+5.49%+137.46%+141.16% 724B
-2.48%+15.91%+305.98%+518.99% 486B
-2.61%+28.79%+197.73%+249.06% 205B
+0.34%+9.63%+312.54%+367.98% 82.07B
0.00%+30.37%+1,820.15%+2,342.98% 33.65B
-3.58%+19.10%+219.08%+112.41% 27.03B
-3.67%+17.25%+101.32%+47.90% 24.84B
+6.55%+29.32%+348.41%+247.48% 21.18B
+0.74%+27.30%+194.11%+268.61% 17.55B
Average -0.66%+21.65%+404.09%+477.40% 180.22B
Weighted average by Cap. -1.94%+15.64%+243.55%+326.12%

Financials

2026 *2027 *
Net sales 30.69B 973M 838M 772M 724M 1.36B 91.93B 1.37B 9.12B 3.56B 45.02B 3.65B 3.57B 156B 33.32B 1.06B 910M 838M 786M 1.48B 99.81B 1.49B 9.9B 3.87B 48.88B 3.96B 3.88B 169B
Net income 3.01B 95.52M 82.33M 75.77M 71.08M 134M 9.03B 135M 896M 350M 4.42B 358M 351M 15.3B 4.26B 135M 116M 107M 101M 189M 12.77B 191M 1.27B 495M 6.25B 507M 496M 21.64B
Net Debt 3.29B 104M 89.87M 82.71M 77.59M 146M 9.85B 147M 978M 382M 4.83B 391M 383M 16.7B 797M 25.26M 21.77M 20.04M 18.8M 35.31M 2.39B 35.66M 237M 92.53M 1.17B 94.8M 92.79M 4.05B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
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