Valuation: CHPMS TCHNLGS

Market Cap 61.25B 1.92B 1.65B 1.54B 1.41B 2.66B 183B 2.68B 18.18B 7.08B 92.34B 7.21B 7.05B 306B P/E 2026 *
18.8x
P/E 2027 * 13.2x
Enterprise Value 66.11B 2.07B 1.78B 1.66B 1.52B 2.87B 198B 2.9B 19.63B 7.64B 99.68B 7.78B 7.61B 330B EV / Sales 2026 *
2.18x
EV / Sales 2027 * 1.96x
Free-Float
77.34%
Yield 2026 *
2.51%
Yield 2027 * 4.03%
Manager TitleAgeSince
Chief Executive Officer 67 17/07/1997
Director of Finance/CFO 54 01/10/2017
Chief Operating Officer - 06/03/2012
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 69 28/06/2007
Director/Board Member 70 17/06/2013
Change 5-day change 1-year change 3-year change Capi.($)
+0.75%-7.41%+132.28%+148.67% 668B
+1.45%-4.04%+210.68%+376.56% 388B
+0.47%-7.79%+175.74%+154.76% 158B
-0.17%-3.90%+311.85%+423.01% 81.74B
+0.45%-7.58%+60.08%+43.94% 21.12B
+0.40%-10.98%+117.82%+57.33% 19.61B
+1.18%-8.96%+133.93%+266.53% 15.63B
+3.08%-7.55%+169.22%+156.71% 13.88B
+1.67%-11.20%+101.66%+84.54% 11.9B
Average +1.18%-10.62%+157.03%+190.23% 153.03B
Weighted average by Cap. +0.93%-8.41%+168.82%+227.83%

Financials

2026 *2027 *
Net sales 30.3B 950M 814M 763M 697M 1.31B 90.54B 1.33B 8.99B 3.5B 45.68B 3.57B 3.49B 151B 35.27B 1.11B 947M 888M 811M 1.53B 105B 1.55B 10.47B 4.08B 53.17B 4.15B 4.06B 176B
Net income 3.28B 103M 88.1M 82.55M 75.4M 142M 9.8B 144M 974M 379M 4.94B 386M 378M 16.38B 4.7B 147M 126M 118M 108M 204M 14.04B 206M 1.39B 543M 7.08B 553M 541M 23.45B
Net Debt 4.86B 152M 131M 122M 112M 211M 14.54B 213M 1.44B 562M 7.33B 573M 560M 24.29B 8.02B 251M 215M 202M 184M 348M 23.96B 351M 2.38B 927M 12.09B 944M 923M 40.03B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Global
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ESG MSCI
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