Valuation: Amkor Technology, Inc.

Market Cap 13.32B 445B 11.69B 11.04B 10.06B 18.83B 1,277B 18.97B 132B 51.16B 652B 50.01B 48.93B 2,096B P/E 2026 *
21x
P/E 2027 * 19x
Enterprise Value 14.43B 482B 12.66B 11.96B 10.9B 20.4B 1,383B 20.54B 143B 55.42B 706B 54.17B 53B 2,271B EV / Sales 2026 *
1.88x
EV / Sales 2027 * 1.66x
Free-Float
42.18%
Yield 2026 *
0.62%
Yield 2027 * 0.68%
1 day+5.20%
1 week+10.30%
Current month+11.66%
1 month+11.66%
1 week 1.62
Extreme 1.62
1.83
1 month 1.5
Extreme 1.5
1.83
Current year 1.5
Extreme 1.5
2.02
1 year 1.5
Extreme 1.5
2.02
3 years 1.5
Extreme 1.5
2.02
5 years 1.5
Extreme 1.5
2.02
10 years 1.5
Extreme 1.5
2.02
Manager TitleAgeSince
Chief Executive Officer 54 01/01/2026
Director of Finance/CFO 52 12/09/2016
Chief Operating Officer - 01/08/1990
Director TitleAgeSince
Director/Board Member 70 01/02/2006
Director/Board Member 72 15/05/2019
Director/Board Member 70 01/02/2013
Change 5-day change 1-year change 3-year change Capi.($)
+5.20%+10.30% - - 13.32B
+1.29%+5.30%+87.58%+174.49% 666B
+2.62%+9.41%+146.01%+407.92% 394B
+4.82%+6.42%+103.90%+169.91% 163B
+0.87%+9.56%+306.40%+521.33% 96.73B
-4.16%-10.39% - - 35.53B
+2.19%+6.78%+65.21%+65.91% 23.21B
+2.84%+4.66%+90.01%+76.49% 23.3B
+3.31%+7.30%+95.80%+266.28% 16.51B
+2.83%+9.19%+124.84%+126.95% 14.12B
Average +2.18%+5.66%+127.47%+226.16% 159.28B
Weighted average by Cap. +2.00%+6.56%+121.25%+260.98%

Financials

2026 *2027 *
Net sales 7.67B 256B 6.73B 6.35B 5.79B 10.84B 735B 10.91B 76.02B 29.44B 375B 28.78B 28.16B 1,206B 8.64B 289B 7.58B 7.16B 6.53B 12.22B 828B 12.3B 85.69B 33.19B 423B 32.44B 31.74B 1,360B
Net income 641M 21.42B 563M 531M 484M 906M 61.45B 913M 6.36B 2.46B 31.39B 2.41B 2.36B 101B 731M 24.43B 642M 606M 552M 1.03B 70.08B 1.04B 7.25B 2.81B 35.8B 2.75B 2.69B 115B
Net Debt 1.11B 37.04B 973M 919M 837M 1.57B 106B 1.58B 11B 4.26B 54.29B 4.16B 4.07B 174B 1.04B 34.72B 912M 861M 785M 1.47B 99.61B 1.48B 10.31B 3.99B 50.89B 3.9B 3.82B 164B
Logo Amkor Technology, Inc.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Employees
30,800
Date Price Change Volume
25/09/26 THB 1.820 +5.20% 111,791
24/09/26 THB 1.730 -5.46% 173,414
23/09/26 THB 1.830 +5.17% 830,849
22/09/26 THB 1.740 -0.57% 635,278
21/09/26 THB 1.750 +6.06% 73,795
Trader
Investor
Global
Quality
ESG MSCI
-
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
11
Last Close Price
53.61USD
Average target price
76.40USD
Spread / Average Target
+42.51%

Quarterly revenue - Rate of surprise