![Sheng Jen Wu](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Sheng Jen Wu
Corporate Officer/Principal at
CHIPBOND TECHNOLOGY CORPORATION
Net worth: 3 M $ as of 30/09/2026
Profile
Sheng Jen Wu has been Senior Vice President-Manufacturing Center at Chipbond Technology Corp.
since 2011.
Mr. Wu graduated from National Tsing-Hua University.
Known holdings in public companies
| Company | Date | Number of shares | Valuation | Valuation date |
|---|---|---|---|---|
| 31/01/2026 | 507,757 ( 0.07% ) | 3 M $ | 30/09/2026 |
Sheng Jen Wu active positions
| Companies | Position | Start |
|---|---|---|
| CHIPBOND TECHNOLOGY CORPORATION | Corporate Officer/Principal | 01/01/2011 |
Education of Sheng Jen Wu
Experiences
Positions held
Active
Inactive
Listed companies
Private companies
Connections
17
1st degree connections
2
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 2 |
|---|---|
Chipbond Technology Corp.
 Chipbond Technology Corp. SemiconductorsElectronic Technology Manufactures and distributes wafer bumps, chips, and other electronic components | Electronic Technology |
National Tsing-Hua University
 National Tsing-Hua University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
- Stock Market
- Insiders
- Sheng Jen Wu
