Valuation: Kinsus Interconnect Technology Corp.

Market Cap 418B 13.14B 11.26B 10.53B 9.63B 18.17B 1,258B 18.36B 125B 48.45B 632B 49.32B 48.25B 2,090B P/E 2026 *
75x
P/E 2027 * 32.1x
Enterprise Value 420B 13.18B 11.29B 10.56B 9.66B 18.23B 1,262B 18.42B 125B 48.61B 634B 49.48B 48.4B 2,096B EV / Sales 2026 *
8.05x
EV / Sales 2027 * 5.33x
Free-Float
60.38%
Yield 2026 *
0.59%
Yield 2027 * 1.43%
1 day+5.16%
1 week-7.73%
Current month+31.50%
1 month+17.44%
3 months+37.11%
6 months+160.12%
Current year+425.16%
1 week 766
Extreme 766
902
1 month 541
Extreme 541
937
Current year 151.5
Extreme 151.5
939
1 year 102
Extreme 102
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+5.16%-7.73%+695.24%+695.24% 13.14B
-0.80%-7.78%+173.63%+440.52% 189B
+1.65%-9.71%+19.24%+273.62% 96.9B
+3.04%-11.89%+364.32%+1,157.30% 61.09B
+1.86%-2.23%+711.11%+479.37% 55.37B
-1.43%-12.32%+258.32%+941.70% 52.49B
-5.14%-15.52% - - 39.52B
-0.77%-13.21%+127.45%+595.81% 34.82B
0.00%-11.24%+11.31%+1,056.16% 34.93B
-1.11%-8.63%+105.45%+438.34% 33.08B
Average +0.25%-4.08%+274.01%+675.34% 61B
Weighted average by Cap. +0.04%-4.64%+223.08%+591.72%

Financials

2026 *2027 *
Net sales 52.15B 1.64B 1.4B 1.31B 1.2B 2.26B 157B 2.29B 15.53B 6.04B 78.72B 6.15B 6.01B 260B 78.56B 2.47B 2.11B 1.98B 1.81B 3.41B 236B 3.45B 23.4B 9.1B 119B 9.26B 9.06B 392B
Net income 5.4B 169M 145M 136M 124M 234M 16.22B 237M 1.61B 625M 8.15B 636M 622M 26.95B 12.92B 405M 348M 325M 297M 561M 38.83B 567M 3.85B 1.5B 19.5B 1.52B 1.49B 64.51B
Net Debt 1.33B 41.85M 35.86M 33.55M 30.67M 57.88M 4.01B 58.5M 397M 154M 2.01B 157M 154M 6.66B 271M 8.5M 7.29M 6.82M 6.23M 11.76M 814M 11.89M 80.68M 31.37M 409M 31.93M 31.24M 1.35B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
25/08/26 NT$835.00 +5.16% 11,413,870
24/08/26 NT$794.00 -2.10% 11,764,951
21/08/26 NT$811.00 -4.70% 17,272,838
20/08/26 NT$851.00 +0.24% 16,928,119
19/08/26 NT$849.00 -1.85% 21,079,068
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
835.00TWD
Average target price
952.77TWD
Spread / Average Target
+14.10%

Quarterly revenue - Rate of surprise

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