Valuation: Kinsus Interconnect Technology Corp.

Market Cap 566B 17.72B 15.83B 14.72B 13.39B 25.28B 1,715B 25.39B 177B 69.43B 874B 66.54B 65.09B 2,806B P/E 2026 *
94.8x
P/E 2027 * 43.4x
Enterprise Value 570B 17.84B 15.94B 14.83B 13.49B 25.46B 1,727B 25.57B 178B 69.91B 880B 67.01B 65.55B 2,826B EV / Sales 2026 *
10.7x
EV / Sales 2027 * 7.27x
Free-Float
60.38%
Yield 2026 *
0.52%
Yield 2027 * 1.18%
1 day-2.27%
1 week+2.38%
Current month+10.82%
1 month+29.99%
3 months+35.22%
6 months+182.15%
Current year+576.10%
1 week 1,030
Extreme 1030
1,150
1 month 784
Extreme 784
1,150
Current year 151.5
Extreme 151.5
1,150
1 year 122.5
Extreme 122.5
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-2.27%+2.38%+681.82%+900.00% 17.72B
-0.52%-2.00%+25.18%+400.63% 5,536B
-1.35%+2.00%+77.08%+379.32% 2,069B
+0.39%+1.80%+11.37%+321.17% 1,726B
-0.66%-4.27%+466.63%+1,389.79% 1,164B
-2.03%-4.07%+182.97%+457.84% 993B
-2.44%-8.69%+292.76%+1,306.69% 913B
-2.22%-12.26%+187.87%+187.40% 550B
+0.95%-6.92% - - 517B
-3.27%-13.40%+72.00%+377.98% 284B
Average -1.34%-4.46%+221.97%+635.65% 1,377B
Weighted average by Cap. -0.85%-2.55%+109.16%+531.91%

Financials

2026 *2027 *
Net sales 53.08B 1.66B 1.48B 1.38B 1.25B 2.37B 161B 2.38B 16.6B 6.51B 81.94B 6.24B 6.1B 263B 78.88B 2.47B 2.2B 2.05B 1.86B 3.52B 239B 3.54B 24.67B 9.67B 122B 9.27B 9.06B 391B
Net income 5.9B 185M 165M 153M 139M 263M 17.86B 264M 1.85B 723M 9.1B 693M 678M 29.22B 14.99B 469M 419M 390M 354M 669M 45.39B 672M 4.69B 1.84B 23.14B 1.76B 1.72B 74.27B
Net Debt 3.98B 124M 111M 103M 94.06M 178M 12.05B 178M 1.24B 488M 6.14B 467M 457M 19.71B 7.33B 229M 205M 191M 173M 327M 22.2B 329M 2.29B 899M 11.32B 861M 843M 36.32B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
08/10/26 NT$1,075.00 -2.27% 7,260,373
07/10/26 NT$1,100.00 +2.80% 13,227,551
06/10/26 NT$1,070.00 -2.28% 10,026,874
05/10/26 NT$1,095.00 +4.29% 30,076,585
02/10/26 NT$1,050.00 +3.96% 18,823,011
Trader
Investor
Global
Quality
ESG MSCI
B
Ratings Surperformance© - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
1,075.00TWD
Average target price
1,042.15TWD
Spread / Average Target
-3.06%

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - Kinsus Interconnect Technology Corp.
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