Darbond Technology Co., Ltd Stock

Darbond Technology Co Ltd is a China-based company mainly engaged in the research, development and industrialization of electronic packaging materials. The products include integrated circuit packaging materials, smart terminal packaging materials, new energy application materials and equipment application materials. Integrated circuit packaging materials mainly include wafer ultraviolet (UV) films, die-bonding materials and flip-chip materials. Smart terminal packaging materials mainly include electronic packaging materials, electromagnetic interference (EMI) shielding materials and board-level packaging materials. New energy packaging materials mainly include two-component polyurethane structural adhesives, UV insulating coatings, tapes and photovoltaic stacked materials. Equipment application materials mainly include one-component epoxy structural adhesives, thread-locking anaerobic adhesives and water-based two-component epoxy structural adhesives.